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FLX2010 Pick & place machine

Since August 2007 our company offers SMD part placing on PCBs in dimensions up to 300 x 400 mm on the FLX2010 Pick & place machine. This machine brings high accuracy and speed to SMD part placement with maximum part dimensions 50 x 50 mm. Laser centering of the parts (important especially for BGA packaged chips), bringing great accuracy to SMD component placement, is installed on the system.

Main parameters FLX 2010

• contactless laser centering
• centering done during head movement without slowing down the placing process
• integrated camera for learning and centering PCBs using centering marks
• intelligent feeders, easy and fast change of SMD parts
• motor driven feeders for 8, 12, 16, 24, 32 mm feeds; tape or rod part feeders
• largest PCB dimensions: 300 x 400 mm
• placing speed up to 3000 parts per hour
• placeable packages: 0402 (0201) to QFP and BGA parts with 0.3mm spacing
• accuracy: chip parts +/- 0.1 mm, parts with delicate pin spacing +/- 0.05mm
• integrated automatic tool change (up to 6 different types)
• programmable vacuum sensor at the nozzle
• minimal space requirements due to compact casing
• maximal safety during operation, both HW and SW protection
• automatic correction of PCB placement
• sensing faulty PCB when series of PCBs is used
• CAD post-processor

Soldering unit

The SV 260 soldering unit is a modern device for vapor soldering for PCBs with largest dimensions 300 x 260 x 80 mm. Vapor soldering is especially well suited for BGA packaged chips.

If you are interested in our services, please contact using email: This e-mail address is being protected from spambots. You need JavaScript enabled to view it or on our telephone number +420 28486 0938.